Off-axis illumination assembly and method
US7458318B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 1, 2006 |
| Grant date | Dec 2, 2008 |
| Priority date | — |
| Expiry date | Jan 27, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/163
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A stencil printer is provided for depositing solder paste onto a surface of an electronic substrate. The stencil printer includes a frame and a stencil coupled to the frame. The stencil has a plurality of apertures formed therein. The stencil printer further includes a dispenser coupled to the frame. The stencil and the dispenser are adapted to deposit solder paste onto the electronic substrate. The stencil printer further includes an imaging system constructed and arranged to capture an image of the electronic substrate. The imaging system includes a camera assembly, an on-axis illumination assembly adapted to generate light substantially along a first axis generally perpendicular to the surface of the electronic substrate, and an off-axis illumination assembly adapted to generate rays of light substantially along a second axis extending at an angle with respect to the first axis. A controller is coupled to the imaging system to control movement of the imaging system to capture an image.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.