Sheet material especially useful for circuit boards
US7459044B2 · kind B2 · utility
6Cited by
13References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 3, 2005 |
| Grant date | Dec 2, 2008 |
| Priority date | — |
| Expiry date | Sep 30, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T442/2861
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A sheet comprising thermoplastic polymer (TP) and short high tensile modulus fibers, in which the concentration of TP in the middle of the sheet is higher than at the surface of the sheet, useful for making prepregs with a thermoset resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.