MEMS mirror made from topside and backside etching of wafer
US7459093B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 10, 2006 |
| Grant date | Dec 2, 2008 |
| Priority date | — |
| Expiry date | Oct 25, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B26/0841
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A process for constructing a micro-electro-mechanical system (MEMS) device includes etching the topside of a silicon wafer to form a first support layer having asymmetric pads. The backside of the silicon wafer is etched to form a top layer with a mirror, beam structures extending from the mirror, and rotating comb teeth extending from the beam structures. Before or after the backside of the silicon wafer is etched, the topside of the silicon wafer is bonded to a glass wafer that forms a second support layer. Prior to bonding the silicon wafer to the glass wafer, the glass wafer may be etched to form a recess and/or a cavity that accommodates mobile elements in the silicon wafer. Due to the asymmetry of the pads in the first support layer below the rotating comb teeth in the top layer, oscillation can be initiated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.