Low pressure thermoforming of thin, optical carriers
US7459120B2 · kind B2 · utility
2Cited by
18References
30Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 4, 2003 |
| Grant date | Dec 2, 2008 |
| Priority date | — |
| Expiry date | Oct 4, 2025 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29K2077/00
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method for thermoforming a thin thermoplastic carrier with uniformity of thickness at optical quality. The sheet to be thermoformed is heated and placed on a vented platform equipped with a mold insert. The thermoformer's platens clamp a shroud over the sheet. A low pressure air stream is introduced into the shroud and deflected from a direct path leading to the mold insert.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.