Stress relief for electroplated films

US7459198B2 · kind B2 · utility

Assignee

• Hitachi Global Storage Technologies Netherlands B.V. · NL

Inventors

• Christian Rene Bonhote · San Jose, US
• Heather K. DeSimone · معلمی نژاد, US
• John W. Lam · San Jose, US
• Matthew Last · San Jose, US
• Edward Hin Pong Lee · San Jose, US
• Ian Robson McFadyen · San Jose, US

Key dates

• Filing date: May 28, 2004
• Grant date: Dec 2, 2008
• Expiry date: Apr 20, 2026

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/24942
• WIPO field: Audio-visual technology
• WIPO sector: Electrical engineering

Abstract

An electroplated film is deposited over a substrate with a plating frame pattern that includes a plating field defined by a plurality of individual features. By dividing the plating field into a plurality of individual features, the delamination force at any location on the plating field is greatly reduced. Thus, a film with a large stress, such as a high moment film, may be plated to a greater thickness than is possible with conventionally plated films.