Method of manufacturing quartz crystal vibrating piece
US7459334B2 · kind B2 · utility
1Cited by
2References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 27, 2006 |
| Grant date | Dec 2, 2008 |
| Priority date | — |
| Expiry date | Aug 14, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG04R20/10
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method of manufacturing a quartz crystal vibrating piece is provided. Etching masks of different sizes are each arranged on respective front and rear surfaces of a quartz crystal wafer such that the etching mask on one of the surfaces (e.g., the rear surface) is larger than the other etching mask. The quartz crystal wafer is etched using the etching masks so that a projection is formed on a side of the quartz crystal wafer due to the difference in size of the etching masks, and is overetched to remove the projection.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.