Method for dividing substrate
US7459377B2 · kind B2 · utility
115Cited by
7References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 7, 2005 |
| Grant date | Dec 2, 2008 |
| Priority date | — |
| Expiry date | Aug 26, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/01
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The present invention aims at providing a method for dividing a substrate that is capable of dividing each substrate into chips in the same square-like form without causing chip breaking and capable of forming all cleaved facets flat. In the method for dividing a substrate of the present invention, an electron beam 1 with the intensity that causes a dislocation inside the substrate is irradiated to a substrate surface 2 to generate a crack starting from such dislocation, and a cleaved facet 5 is formed to divide the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.