RIM slot filler module and method of manufacturing the same
US7459642B2 · kind B2 · utility
3Cited by
4References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 30, 2002 |
| Grant date | Dec 2, 2008 |
| Priority date | — |
| Expiry date | Dec 2, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/1429
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A slot filler module is presented. The slot filler module includes a RIM molded encapsulant, an insert disposed in a predetermined location within the encapsulant and a connector disposed proximate a first end of the RIM molded encapsulant.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.