Reprogrammable metal-to-metal antifuse employing carbon-containing antifuse material
US7459763B1 · kind B1 · utility
261Cited by
41References
33Claims
0Family size
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Key dates
| Filing date | Feb 20, 2004 |
| Grant date | Dec 2, 2008 |
| Priority date | — |
| Expiry date | Feb 20, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A reprogrammable metal-to-metal antifuse is disposed between two metal interconnect layers in an integrated circuit. A lower barrier layer is formed from Ti. A lower adhesion-promoting layer is disposed over the lower Ti barrier layer. An antifuse material layer selected from a group comprising at least one of amorphous carbon and amorphous carbon doped with at least one of hydrogen and fluorine is disposed over the lower adhesion-promoting layer. An upper adhesion-promoting layer is disposed over the antifuse material layer. An upper Ti barrier layer is disposed over the upper adhesion-promoting layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.