Face-to-face bonded I/O circuit die and functional logic circuit die system
US7459772B2 · kind B2 · utility
259Cited by
5References
19Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 29, 2004 |
| Grant date | Dec 2, 2008 |
| Priority date | — |
| Expiry date | Sep 29, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/00014
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
An integrated circuit system includes a first set of integrated circuit dice each member of the set having a different configuration of input/output circuits disposed thereon and a second set of integrated circuit dice each having different logical function circuits disposed thereon. Each member of the first and second sets of integrated circuit dice include an array of face-to-face bonding pads disposed thereon that mate with the array of face-to-face bonding pads of each member of the other set.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.