Methods for forming contact hole, for manufacturing circuit board and for manufacturing electro-optical device
US7459793B2 · kind B2 · utility
1Cited by
4References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 31, 2006 |
| Grant date | Dec 2, 2008 |
| Priority date | — |
| Expiry date | Jan 17, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K71/40
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for forming a contact hole, a method for manufacturing a circuit board and a method for manufacturing an electro-optical device that increase the reliability of electrical coupling via a conductive part and prevent wire-breaking due to projections when forming a contact hole in an interlayer film by using a needle, and burying a conductive material in the contact hole is provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.