Method to build a wirebond probe card in a many at a time fashion
US7459795B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 19, 2004 |
| Grant date | Dec 2, 2008 |
| Priority date | — |
| Expiry date | Dec 3, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49224
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Resilient spring contacts for use in wafer test probing are provided that can be manufactured with a very fine pitch spacing and precisely located on a support substrate. The resilient contact structures are adapted for wire bonding to an electrical circuit on a space transformer substrate. The support substrates with attached spring contacts can be manufactured together in large numbers and diced up and tested before attachment to a space transformer substrate to improve yield. The resilient spring contacts are manufactured using photolithographic techniques to form the contacts on a release layer, before the spring contacts are epoxied to the support substrate and the release layer removed. The support substrate can be transparent to allow alignment of the contacts and testing of optical components beneath. The support substrate can include a ground plane provided beneath the spring contacts for improved impedance matching.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.