Surface acoustic wave device and method of manufacturing the same, IC card, and mobile electronic apparatus
US7459829B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 16, 2005 |
| Grant date | Dec 2, 2008 |
| Priority date | — |
| Expiry date | Nov 3, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H3/08
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A surface acoustic wave device includes a surface acoustic wave (SAW) chip and a cover that are bonded in a body by bonding a metal bonding portion of the SAW chip and a metal bonding portion of the cover and bonding extraction electrodes of the SAW chip and connection electrodes of the cover so as to hermetically seal IDT electrodes disposed on a main surface of a piezoelectric substrate of the SAW chip within a space defined between the SAW chip and the cover. The IDT electrodes and external electrodes on an upper surface of an insulating substrate of the cover are electrically connected to each other through conductive materials formed in through-holes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.