SAW component having an improved temperature coefficient
US7459991B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 16, 2003 |
| Grant date | Dec 2, 2008 |
| Priority date | — |
| Expiry date | May 25, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H9/14538
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
An apparatus including a piezoelectric substrate having at least one transducer electrode structure. The structure having a metallization formed by one or more metals with a mean specific density that is at least 50% higher than that of aluminum. The structure having a compensation layer that is applied fully or partially over the metallization. The compensation layer is of a material having a temperature dependence of elastic constants that counteracts the temperature coefficient of frequency of the substrate. The compensation layer has a thickness that is less than 15% of an acoustic wavelength of a wave capable of propagation in the structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.