Multi-temperature programming for accelerometer
US7461535B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 1, 2006 |
| Grant date | Dec 9, 2008 |
| Priority date | — |
| Expiry date | Apr 6, 2027 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01P21/00
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A system and method for testing and calibrating integrated sensor devices that improves the manufacturing test throughput of the devices. The system includes a tester, a temperature controller, and at least one probe station including a thermal chuck. The chuck can be heated to specified temperatures to achieve variable heating of a wafer, PCB, or pallet disposed thereon. The temperature controller adjusts the temperature of the chuck to a first specified level. The tester performs at least one first measurement of the output offset of each integrated sensor embodied as a die on the wafer, or as a device on the PCB or pallet. Next, the temperature controller adjusts the temperature of the chuck to a second specified level, and the tester performs at least one second measurement of the output offset of each integrated sensor at the second temperature level. The offset temperature coefficient (OTC) of each sensor is calculated based upon the output offset measurements performed at the first and second temperature levels, and optimal settings for calibrating the respective sensors are determined based upon the calculated OTC values. After the temperature of the chuck is brought back d…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.