Device and method for vacuum film formation
US7462244B2 · kind B2 · utility
4Cited by
18References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 21, 2002 |
| Grant date | Dec 9, 2008 |
| Priority date | — |
| Expiry date | Nov 21, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E60/10
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A vacuum deposition apparatus is used for deposit evaporated substance from evaporation sources (6a and 6b) on the desired position of a flexible substrate (1). While the flexible substrate (1) is carried using rollers in a vacuum, shutters (8a and 8b) are opened and closed to control the movement of the evaporated substance via openings. A film having a desired shape of pattern is formed on the flexible substrate (1) with higher controllability.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.