Method of manufacturing an encapsulated package for a magnetic device
US7462317B2 · kind B2 · utility
44Cited by
54References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 10, 2004 |
| Grant date | Dec 9, 2008 |
| Priority date | — |
| Expiry date | Nov 23, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing an encapsulated package for a magnetic device on a substrate. In one embodiment, the method includes providing a magnetic core on the substrate and placing a shielding structure over the magnetic core to create a chamber thereabout. The method also includes depositing an encapsulant about a portion of the magnetic core within the chamber. The shielding structure limits the encapsulant entering the chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.