Silicone metalization
US7462518B2 · kind B2 · utility
0Cited by
8References
1Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 24, 2006 |
| Grant date | Dec 9, 2008 |
| Priority date | — |
| Expiry date | Apr 3, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0162
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A system for providing metal features on silicone comprising providing a silicone layer on a matrix and providing a metal layer on the silicone layer. An electronic apparatus can be produced by the system. The electronic apparatus comprises a silicone body and metal features on the silicone body that provide an electronic device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.