Pressure-sensitive adhesive composition
US7462663B2 · kind B2 · utility
4Cited by
1References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 20, 2006 |
| Grant date | Dec 9, 2008 |
| Priority date | — |
| Expiry date | Oct 20, 2026 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2666/44
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The present invention relates to a pressure-sensitive adhesive composition, and more precisely, a pressure-sensitive adhesive composition containing an organic silane compound that exhibits excellent initial adhesive strength on a substrate, and does not leave any of the adhesive behind when removed because the adhesive power is not excessively increased even at high temperature or at high temperature and high humidity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.