Patent · US Expired

Low VOC-solvent based mold release agent and curable mold release compositions based thereon

US7462668B2 · kind B2 · utility

10Cited by

17References

4Claims

0Family size

Assignee

Henkel Limited

Inventors

Zheng Lu · Kingwood, US
Randy L. Smith · Portsmouth, US
Tamara Lynn Harmar · Kingston, US
Daniel Shaw · Geneva, US

Key dates

Filing date	Jul 20, 2004
Grant date	Dec 9, 2008
Priority date	—
Expiry date	May 1, 2025

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC08L83/16
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

The present invention relates to curable mold release compositions containing a non-volatile organic (non-VOC), or low-volatile organic (low-VOC), component employed as a carrier for a curable component. When applied as a coating the mold release compositions cure to a finish having a high durability that is sustained throughout multiple releases.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.