Systems and methods for bonding
US7462831B2 · kind B2 · utility
16Cited by
88References
39Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 30, 2006 |
| Grant date | Dec 9, 2008 |
| Priority date | — |
| Expiry date | Nov 30, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Systems and methods for bonding semiconductor devices and/or multiple wafers, in the form of a first segmented wafer and a second unsegmented wafer which may have different temperature coefficients of expansion (TCE), and which may be bonded together, with or without the presence of a vacuum.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.