Lightweight C-sandwich radome fabrication
US7463212B1 · kind B1 · utility
18Cited by
27References
43Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 15, 2006 |
| Grant date | Dec 9, 2008 |
| Priority date | — |
| Expiry date | May 15, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q1/42
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A C-sandwich radome structure includes a first core, an outer skin layer on the first core, a second core, and an inner skin layer on the second core. An intermediate skin layer is disposed between the first core and the second core and the intermediate skin layer includes a dielectric enhancer for raising the dielectric constant of the intermediate skin layer so the intermediate skin layer can be made thinner to reduce the weight and cost of the structure while maintaining the electrical transmission performance of a thicker, heavier intermediate skin layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.