Low-profile board level EMI shielding and thermal management apparatus and spring clips for use therewith
US7463496B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 1, 2006 |
| Grant date | Dec 9, 2008 |
| Priority date | — |
| Expiry date | Feb 4, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
According to various aspects of the present disclosure, exemplary embodiments are provided of low-profile apparatus capable of providing board level shielding for one or more electrical components while also providing dissipation of heat generated by the one or more electrical components. In one particular embodiment, an apparatus generally includes a resiliently compressible EMI gasket, a heat sink, and a spring clip. The spring clip has resilient legs with feet. The feet are configured to engage the board. When the feet are engaged with the board, a clamping force is generated that compressively biases the heat sink and the resiliently compressive EMI gasket generally towards the board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.