Method for determining addendum and binder surfaces of springback compensated stamping dies
US7464011B2 · kind B2 · utility
5Cited by
1References
8Claims
0Family size
Assignee
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Key dates
| Filing date | Jan 26, 2006 |
| Grant date | Dec 9, 2008 |
| Priority date | — |
| Expiry date | Apr 8, 2027 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F30/15
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method for determining compensated addendum and binder surfaces as part of a springback compensated stamping die for producing a stamped part includes modeling of the existing addendum surface and binder surface of the stamping die. The addendum and binder surfaces are modified according to a number of compensatory surface displacements and in-plane rotations required for springback compensation of the finished stamped part. Following this modification, the stamped part may be separated from the addendum and binder without a loss of dimensional accuracy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.