Method of forming anisotropic heat spreading apparatus for semiconductor devices
US7464462B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 15, 2007 |
| Grant date | Dec 16, 2008 |
| Priority date | — |
| Expiry date | Oct 15, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/236
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for forming a heat spreading apparatus for semiconductor devices is disclosed. The method includes extruding a frame material to form multiple individual cells including fillable openings within the frame material; filling a first group of the individual cells with one or more high thermal conductivity materials; filling at least a second group of the individual cells with one or more materials of lower thermal conductivity than in the first group of the individual cells; and implementing a reflowing process following filling the multiple individual cells so as to infiltrate the materials within the individual cells, wherein defined walls of the frame material remain following the reflowing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.