Wire bonding method and apparatus therefor
US7464851B2 · kind B2 · utility
0Cited by
5References
7Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 21, 2002 |
| Grant date | Dec 16, 2008 |
| Priority date | — |
| Expiry date | Jun 3, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19041
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods and apparatus for detecting the welding state in each bonding section and the application of ultrasonic vibration and pressing force is stopped promptly when completion of welding is determined. This permits bonding to be finished, corresponding to each wire bonding section at all times, in a shortest time without need of application of unnecessary ultrasonic vibration and pressing force after completion of welding in spite of dispersion of the welding characteristic of the individual bonding pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.