CMP conditioner, method for arranging hard abrasive grains for use in CMP conditioner, and process for producing CMP conditioner
US7465217B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 20, 2006 |
| Grant date | Dec 16, 2008 |
| Priority date | — |
| Expiry date | Mar 20, 2026 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D18/00
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Disclosed are CMP conditioners which can suppress microscratching of the surface of a semiconductor substrate and can realize stable CMP conditioner properties. The CMP conditioner according to the first aspect of the present invention comprises a support member and a plurality of hard abrasive grains provided on a surface of the support member, wherein the plurality of hard abrasive grains are regularly arranged on the surface of the support member. The CMP conditioner according to the second aspect of the present invention comprises a support member and a plurality of hard abrasive grains provided on the surface of the support member, wherein the plurality of hard abrasive grains are arranged on the surface of the support member regularly and so as for the density of the hard abrasive grains to decrease from the inner side of the support member toward the outer side of the support member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.