Electrically disbondable compositions and related methods
US7465492B2 · kind B2 · utility
12Cited by
13References
51Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 17, 2006 |
| Grant date | Dec 16, 2008 |
| Priority date | — |
| Expiry date | Jul 24, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31663
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Compositions capable of rapidly curing to a strong substrate bond are removable from a surface to which the composition is bonded without damage to the underlying substrates. The compositions of the present invention may be used in both temporary and permanent bonding and coating applications.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.