Integrated circuit with substantially perpendicular wire bonds
US7465655B2 · kind B2 · utility
1Cited by
6References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 27, 2006 |
| Grant date | Dec 16, 2008 |
| Priority date | — |
| Expiry date | Feb 26, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for performing a wire-bonding operation in an integrated circuit utilizes a bonding tool. A wire is bonded to a first bond site in the integrated circuit, and terminated at a second bond site in the integrated circuit. The bonding and terminating steps are repeated for a plurality of additional wire bonds of the integrated circuit. At least two wire bonds in the integrated circuit are substantially perpendicular to one another at a crossing point in a plan view of the integrated circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.