Optical device chip, and optical module and method for manufacturing the same
US7466733B2 · kind B2 · utility
2Cited by
3References
1Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 23, 2007 |
| Grant date | Dec 16, 2008 |
| Priority date | — |
| Expiry date | Apr 23, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/84
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An optical device chip includes: a first semiconductor layer of a first conductivity type; an optical layer that emits light or receives light formed above the first semiconductor layer; a second semiconductor layer of a second conductivity type formed above the optical layer; a first electrode electrically connected to the first semiconductor layer; a second electrode electrically connected to the second semiconductor layer; and a connecting section that short-circuits the first electrode and the second electrode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.