Method of forming a sputtering target assembly and assembly made therefrom
US7467741B2 · kind B2 · utility
24Cited by
18References
42Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 21, 2003 |
| Grant date | Dec 23, 2008 |
| Priority date | — |
| Expiry date | Aug 2, 2025 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/3407
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of forming a sputtering target assembly and the sputtering target assembly made therefrom are described. The method includes bonding a sputtering target to a backing plate at a low temperature. Also described is a method of forming a sputtering target assembly such that a gap is formed between the sputtering target and the backing plate. Also described is a method of forming a sputtering target assembly providing a mechanism to prevent unintended sputtering into the backing plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.