Signal line circuit device
US7468645B2 · kind B2 · utility
4Cited by
5References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 28, 2005 |
| Grant date | Dec 23, 2008 |
| Priority date | — |
| Expiry date | Jan 28, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/2036
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A signal line circuit device is disposed on top of a mounting substrate. The signal line circuit device comprises a dielectric layer, a signal line formed on one surface of the dielectric layer, and a spacer (formed from a solder or a photo solder resist), which is formed between the mounting substrate and the dielectric layer, and generates a space separation between the signal line and the mounting substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.