In SITU application of anti-stiction materials to micro devices
US7468830B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 28, 2006 |
| Grant date | Dec 23, 2008 |
| Priority date | — |
| Expiry date | Jul 14, 2026 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2201/112
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method for applying anti-stiction material to a micro device on a substrate includes introducing anti-stiction material on a surface of an encapsulation device or a surface of the substrate and sealing at least a portion of the encapsulation device to the surface of the substrate to form a chamber to encapsulate the micro device and the anti-stiction material. The micro device includes a first component and a second component. The first component is moveable and is configured to contact the second component. The method also includes vaporizing the anti-stiction material and depositing the anti-stiction material on a surface of the first component or a surface of the second component after vaporizing the anti-stiction material to prevent stiction between the first component and the second component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.