Method for using partitioned masks to build a chip
US7469401B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 22, 2006 |
| Grant date | Dec 23, 2008 |
| Priority date | — |
| Expiry date | Jul 19, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D89/10
Abstract
A mask reuse methodology process in which the soft logic is implemented with a generic array type cell structure mask and a custom blocking mask. A method is provided comprising printing a set of component cores onto a die at predetermined locations with a reusable mask set; providing a custom blocking mask that includes opaque regions that positionally correspond with the component cores on the die; superimposing the custom blocking mask with a generic array type cell mask to form superimposed masks; and using the superimposed masks to print generic array type cells onto the die with the exception of the predetermined locations where the set of component cores reside.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.