Package structure of pressure sensor
US7469590B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 11, 2007 |
| Grant date | Dec 30, 2008 |
| Priority date | — |
| Expiry date | Oct 11, 2027 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01L9/0075
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A pressure-sensor package mainly includes a pressure sensor, a support substrate, and a resin layer. The pressure sensor includes a glass substrate having a fixed electrode, and a silicon substrate having a diaphragm that is disposed apart from the fixed electrode by a predetermined distance. The support substrate is a silicon/glass composite substrate on which the pressure sensor is mounted such that the support substrate and the diaphragm face each other. The resin layer fixes the pressure sensor and the support substrate together. The pressure sensor is mounted on a mounting area of the support substrate with a joint member therebetween. Accordingly, even if a gap between the support substrate and the diaphragm has a size of about several micrometers, the pressure-sensor package is capable of performing pressure detection with high sensitivity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.