Method of manufacturing a cutting element from a partially densified substrate
US7470341B2 · kind B2 · utility
7Cited by
25References
34Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 18, 2003 |
| Grant date | Dec 30, 2008 |
| Priority date | — |
| Expiry date | Sep 12, 2024 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC04B2235/9615
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A method of manufacturing a cutting element having a substrate and an ultra hard material layer sintered together where at least a portion of the substrate is partially densified prior to sintering, is provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.