Forming method of stacking structure and manufacturing method of electron source and image display apparatus using such method
US7470554B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 29, 2005 |
| Grant date | Dec 30, 2008 |
| Priority date | — |
| Expiry date | Sep 1, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1126
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of forming a stacking structure by forming an electroconductive layer precursor pattern by an electroconductive paste made of a resin component, electroconductive fine particles, and glass fine particles, forming a dielectric layer precursor pattern by a dielectric paste made of a resin component and glass fine particles, and simultaneously baking both of those patterns, wherein they are held for a predetermined time while keeping a baking temperature which is equal to or higher than a decomposing temperature of the resin component and is equal to or lower than a baking start temperature of the glass fine particles and, thereafter, their baking is completed at the baking temperature which is equal to or higher than the baking start temperature of the glass fine particles and is lower than its softening point. Thus, the occurrence of a void and a pin hole in an insulative layer can be prevented in the stacking structure after the baking.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.