Mounting structure, electro-optical device, and electronic apparatus
US7470986B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 4, 2006 |
| Grant date | Dec 30, 2008 |
| Priority date | — |
| Expiry date | Jul 10, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A mounting structure is provided. The mounting structure includes: a substrate; a line formed on the substrate; an electronic component in which a terminal having a protrusion protruded to the substrate and made of an elastic material and a conductive member disposed on the protruded surface of the protrusion and electrically connected to the line is disposed on a mounting surface of the electronic component opposed to the substrate; and an adhesive in which metal powders, a part of which is interposed between the conductive member and the line, are mixed and which serves to bond and fix the electronic component to the substrate. Here, the conductive member and the line interpose the metal powders therebetween and come in surface-contact with each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.