Method and apparatus for bump inspection
US7471381B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 23, 2006 |
| Grant date | Dec 30, 2008 |
| Priority date | — |
| Expiry date | Aug 1, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01B11/306
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method of dynamically imaging, calibrating and measuring bump height and coplanarity of a plurality of bumps on a surface is disclosed. The method includes illuminating the plurality of bumps with multispectral light from at least one light source, and receiving light of a first wavelength at an imaging device such that a top view image of at least a portion of the plurality of bumps is captured. The light of the first wavelength is reflected off the plurality of bumps at a first angle from the surface. Light of a second wavelength is received at the imaging device such that at least one oblique side view image of at least a portion of the plurality of bumps is captured. The light of the second wavelength is reflected off the plurality of bumps at a second angle from the surface. The captured images are processed to determine absolute bump height and coplanarity. A corresponding apparatus is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.