Modular head lamination device and method
US7472736B2 · kind B2 · utility
26Cited by
16References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 14, 2005 |
| Grant date | Jan 6, 2009 |
| Priority date | — |
| Expiry date | Mar 26, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T483/17
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A composite item is fabricated with a device. The device includes and end effector and a positioning device. The end effector places a tow. The end effector includes a spindle, compaction device, and a path. The spindle detachably secures a spool of tow and the path is disposed from the spool to the compaction device. The positioning device positions the end effector. The end effector is detachably secured to the positioning device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.