Selective rework process and apparatus for surface mount components
US7472818B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 28, 2006 |
| Grant date | Jan 6, 2009 |
| Priority date | — |
| Expiry date | Mar 15, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/176
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus and method for selective rework for surface mount components. A shield assembly encloses a circuit board on which Surface Mount Technology (SMT) modules are soldered. The shield assembly includes a top shield member having an opening over an SMT module to be removed from the circuit board, and a bottom shield member having an opening exposing the solder mount of the SMT module to be removed. An intermediate shield member is located in the opening in the top shield member and extends through the opening to the circuit board and surrounds the SMT module to be removed. A spring loaded mechanism is positioned over the intermediate shield member and grips the SMT module to be removed. The spring loaded mechanism applies removal force for removing the SMT module from the circuit board when heat is applied causing the solder holding the SMT module to the circuit board to reflow.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.