Thermal sensing

US7473030B2 · kind B2 · utility

Assignee

• Palo Alto Research Center Incorporated · US

Inventors

• Richard H. Bruce · Los Altos, US
• Dirk De Bruyker · Palo Alto, US
• Francisco E. Torres · San Jose, US
• Michal V. Wolkin · Los Altos, US

Key dates

• Filing date: Jun 27, 2005
• Grant date: Jan 6, 2009
• Expiry date: Sep 25, 2025

Classification

• Technology area (CPC G): Physics
• CPC primary: G01N25/482
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

In thermal sensing devices, such as for calorimetry, a support layer or central layer can have a thermometer element or other thermal sensor on one side and a thermally conductive structure or component on the other. The thermally conductive structure can conduct temperature or other thermal input signals laterally across the support layer or central layer. The temperature or signals can then be provided to the thermometer element, such as by thermal contact through the support layer. An electrically conducting, thermally isolating anti-coupling layer, such as of gold or chromium, can reduce capacitive coupling between the thermally conductive structure and the thermometer element or other thermal sensor.