Printed circuit board and manufacturing method thereof
US7473099B2 · kind B2 · utility
1Cited by
5References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 27, 2006 |
| Grant date | Jan 6, 2009 |
| Priority date | — |
| Expiry date | Dec 27, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board and manufacturing method thereof are disclosed. A printed circuit board composed of an insulation substrate, which includes an insulation layer, a circuit pattern formed on one side of the insulation layer, and an interlayer passage joined to the insulation layer and configured to electrically connect with the circuit pattern, and a heat-release layer, which is stacked on the other side of the insulation layer to be stacked on the insulation substrate, can provide a high heat-releasing effect and high bending strength, by means of inner layers or ground layers formed by the heat-release layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.