Etching liquid
US7473380B2 · kind B2 · utility
0Cited by
6References
10Claims
0Family size
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Inventors
Key dates
| Filing date | Nov 22, 2002 |
| Grant date | Jan 6, 2009 |
| Priority date | — |
| Expiry date | Apr 30, 2024 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC11D2111/22
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
An etching liquid contains iodine, an iodine compound and alcohol as solute, and solvent such as water. The etching liquid etches a gold or gold alloy layer formed on the surface of a substrate for a semiconductor device or a liquid crystal device evenly. A plurality of gold or gold alloy columns is formed on the layer. The columns are etched scarcely by the etching liquid. The etching liquid etches the gold or gold alloy layer existing between the columns evenly. The etching liquid may further contain a surfactant.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.