Composition for forming silicon film and method for forming silicon film
US7473443B2 · kind B2 · utility
18Cited by
6References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 15, 2003 |
| Grant date | Jan 6, 2009 |
| Priority date | — |
| Expiry date | Apr 16, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02686
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
There are provided a silicon-film-forming composition containing silicon particles and a dispersion medium and a method for forming a silicon film by forming a coating film of the silicon-film-forming composition on a substrate and subjecting the coating film to instantaneous fusion, a heat treatment or a light treatment. According to the composition and the method, a polysilicon film with a desired thickness which may be used as a silicon film for a solar battery can be formed efficiently and easily.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.