Temporary chip attach using injection molded solder
US7473580B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 18, 2006 |
| Grant date | Jan 6, 2009 |
| Priority date | — |
| Expiry date | Jan 13, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An improved method for performing an improved Temporary Chip Attach utilizing an Injection Molded Solder (IMS) process to allow efficient testing of die for creating a Known Good Die Bank. The IMS is applied to the testing substrate to form a column on the substrate. The die to be tested can then be attached to the IMS column with C4 solder. A slight reflow is then applied to the die, allowing some of the C4 to melt, and form an electrical connection with the corresponding IMS column. After testing, the die can be removed along with the C4 from the IMS column or permanently attached the substrate by performing a full reflow of the C4.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.