Method for fabricating conductive layer
US7473642B2 · kind B2 · utility
0Cited by
3References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 12, 2007 |
| Grant date | Jan 6, 2009 |
| Priority date | — |
| Expiry date | Jun 12, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0709
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for fabricating a conductive layer is provided. First, a substrate is provided and a patterned adhesion layer is formed on the substrate. Next, a chemical plating process is performed to form a first metal layer on the patterned adhesion layer by placing the substrate in an electroplating solution and the electroplating solution is shocked. Thereafter, a second metal layer is formed on the first metal layer by performing a plating process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.