Circuit device
US7473853B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 27, 2006 |
| Grant date | Jan 6, 2009 |
| Priority date | — |
| Expiry date | Jan 15, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides a circuit device capable of controlling deformation of a circuit device while preventing an insulating layer from peeling from a substrate. The circuit device includes a substrate, an insulating layer formed on the substrate, a filler filled into the insulating layer, a conductive layer formed on the insulating layer, and a circuit element formed on the conductive layer, wherein an average particle diameter of the filler filled into the insulating layer is controlled so that a Young's modulus of a part of the insulating layer on a substrate side can be smaller than a Young's modulus of a part of the insulating layer on an opposite side relative to the substrate side.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.