Flexible head probe for sort interface units
US7474113B2 · kind B2 · utility
2Cited by
5References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 25, 2002 |
| Grant date | Jan 6, 2009 |
| Priority date | — |
| Expiry date | Oct 25, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2831
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Embodiments of the invention provide a flexible probe head that improves contact force and uniform mechanical contact pressure between the probe feature and an engaged bond pad. Flexible probe head is formed from a plurality of conductive wires embedded in a high frequency elastomer material. During wafer sort, the flexible probe head is in contact communication with die under test. The flexible probe head assumes the natural co-planarity of the surface of the die under test and sort interface unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.