Surface acoustic wave device
US7474175B2 · kind B2 · utility
6Cited by
5References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 27, 2006 |
| Grant date | Jan 6, 2009 |
| Priority date | — |
| Expiry date | Dec 14, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15174
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A surface acoustic wave device having a three-layered structure of sealing resin for sealing a mounting substrate and a surface acoustic wave element in which the elastic modulus of resin of the intermediate layer is higher than that of resin of the outermost layer and the elastic modulus of resin of the innermost layer is lower than that of resin of the outermost layer. The three-layered structure of the sealing resin suppresses crush of a bump when a pressure is applied from the outside and reduces stress applied to the bump due to the change in temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.